Thermal Management
Equipment that dispenses thermally conductive material onto printed circuit boards
Thermal management is the process of dispensing either a single-component or plural-component thermally conductive material onto printed circuit boards within electronic control modules. Thermally conductive material draws heat away from a printed circuit board and extends the life of the control module.
The dispensed media, which is usually high-viscosity and silicone based, contains a thermally conductive abrasive filler. Volumes dispensed generally range from 1 to 50 cc’s.
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Ambient Supply Systems
Bulk unloaders for ambient sealants, adhesives and other medium to high-viscosity materials
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Dispensit 1052 and 1053 Valves
Positive displacement metering rod valves for low to high viscosity materials
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Dispensit 1092 and 1093 Valves
Positive displacement metering rod valves for low to high viscosity materials
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EFR
The Electric Fixed Ratio System (EFR) can handle a wide range of 2K materials, and can provide a precise dispensi...
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General Industry Supply Systems
Bulk material unloader for ambient sealants, adhesives, grease and other medium to hig...
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PD44
For micro dispensing two-component materials
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PR70
Compact Benchtop Meter, Mix and Dispense System
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UniXact Automated Dispensing Solutions
Precision fluid dispense for the toughest applications