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CoolTherm SC-320
Thermally conductive silicone encapsulant | LORD
LORD CoolTherm SC-320
Product description:
LORD CoolThermTM SC-320 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
Features and benefits:
Low stress – exhibits low shrinkage and stress on components as it cures.
Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.
Low viscosity – maintains a low viscosity for ease of component encapsulation compared to other highly thermally conductive materials.
Environmentally resistant – provides excellent thermal shock resistance.
UL rated – provides excellent flame retardancy; UL 94 V-0 certified.
Typical properties*
| SC-320 resin | SC-320 hardener | Mixed | |
| Appearance | Pink liquid | White liquid | Light pink liquid |
| Viscosity, cps @ 25˚C | 25,000 | 20,000 | 22,000 |
| Specific gravity | 3.1 | 3.1 | 3.1 |
| Gel time, min @ 121˚C | - | - | 2-5 |
| Working life, min @ 25˚C | - | - | 40 |
| *Data is typical and not to be used for specification purposes | |||
Application:
Mixing – thoroughly mix each component prior to combining resin and hardener. Mix CoolTherm SC-320 resin with CoolTherm SC-320 hardener at a 1:1 ratio, by weight or volume. Automatic metering/mix/dispense equipment may be used for high volume production. Unless a closed-chamber mechanical mixer is used, air may be introduced into the encapsulant system either during mixing or when catalysing the mixture. Electrical properties of the silicone encapsulant are best when air bubbles and voids are minimised. Therefore, in extremely high voltage or other critical applications, vacuuming may be appropriate.
Applying – apply silicone encapsulant using handheld cartridges or automatic meter, mix and dispense equipment. Avoid applying encapsulant to surfaces that contain cure inhibiting ingredients, such as amines, sulphur, or tin salts. If a bonding surface is in question, apply a test patch of encapsulant to the surface and allow it to set for the normal cure time.
Curing – allow the encapsulant to cure for 24 hours at room temperature (25°C) or for 60 minutes at 125°C. This time-at-temperature profile refers to the time the material should be allowed to cure once it reaches the target temperature. Allowance should be made for oven ramp rates, parts with large thermal mass and other circumstances that may delay material reaching the target temperature.
