Assembly
Solutions to meet the unique specifications of your fluid dispensing processes. Applications include bonding, sealing, encapsulation, underfill, and thermal management.
Solutions for Electronics Manufacturing
Automated Dispense Systems Improve Manufacturing Efficiencies
Precision automated dispense equipment can help electronics equipment manufacturers and electronics manufacturing services (EMS) increase efficiency by reducing material costs and improving processes for product assembly.
As consumer, medical and automotive markets dictate the need for smaller devices, Graco single-source automated dispense equipment provides accurate material dispense capability so manufacturers have greater design flexibility and keep production costs down to stay competitive.
Recommended Articles for Electronics Assembly
Thermal Paste vs. Thermal Pads
Thermal Interface Materials: Thermal paste/grease vs. thermal pads
Ratio Check - Dispensing Two-Component Materials
Learn how to validate MMD equipment setup and process parameters to ensure mix quality and equipment integrity.
Precision Dispense for Bonding and Sealing
Precision dispense and laying the perfect bead
One Component Metering Systems Performance Evaluation for Sealing Applications
Comparison of Graco's three primary solutions for continuous single component dispensing applications; Precision Gear Meter (PGM), Precision Continuous Flow (PCF) and E-Flo iQ.
Knit Line Dispense Techniques
Learn about different dispense and automation techniques for cure-in-place and form-in-place gasketing and how it impacts the fusion of the bead.
Increased Production Efficiency for Perform with Graco Electric Supply Pumps
Learn how Perform achieved material savings, reduced electricity costs, and significant noise level reduction through a "Greener Energy" solution.
Improved Sealing with Liquid Gaskets
Liquid gaskets offer superior sealing in a variety of applications
Graco iQ Dispense Valves Deliver Longer Life
Graco iQ Dispense Valves deliver long-lasting and dependable performance for one-component sealant and adhesive dispensing applications.
Equipment Considerations for Dynamic Mixing Two Component Materials
Learn more about equipment factors for dynamic mixing two-component foaming urethanes and silicones.
Controlling Excess Heat
Proper heat dissipation keeps electronics components running optimally
Comparing 2k Meter Mix Dispense Systems
Comparison chart of Graco's advanced two-component meter mix dispense (MMD) systems including PR-X, PD44, PR70, EFR, and HFR.
Comparing 1k Metering & Dispensing Systems
Factors such as shot size, flow rate, material properties, and manufacturing style should be considered when to choosing a 1k dispensing solution.
Related Materials
Laird T-Putty 607
Laird T-Putty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind.
Laird T-Putty 508
Laird T-Putty 508 is a thermal paste designed for heat dissipation in electronics applications.
Shin-Etsu SDP 3540 A/B
Shin-Etsu's SDP-3540 A/B is a dual component thermal interface gap filler which provides superior thermal conductivity and electrical insulation, and low thermal resistance.
Therm-a-Gap Gel 30
THERM-A-GAP Gel 30 is a dispensable, very low-compression force thermal gap filler that provides superior long-term thermal stability and reliable performance.
