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Thermal Management
Dispense Solutions for Thermal Management
As the world moves more towards electrification, the need to manufacture electronics is increasing. Consumer and industrial demand for greater functionality with a smaller product footprint make managing the thermal load critical to product life cycles and reliability.
Thermal interface materials help efficiently dissipate the heat generated in electronic parts. Accurate dispense of TIMs is important to the performance, quality and durability of electronic products.
Related Articles
Thermal Paste vs. Thermal Pads
Thermal Interface Materials: Thermal paste/grease vs. thermal pads
Comparing 1k Metering & Dispensing Systems
Factors such as shot size, flow rate, material properties, and manufacturing style should be considered when to choosing a 1k dispensing solution.
Comparing 2k Meter Mix Dispense Systems
Comparison chart of Graco's advanced two-component meter mix dispense (MMD) systems including PR-X, PD44, PR70, EFR, and HFR.
Thermal Management Benefits for EV Battery
Thermal management is critical for electric vehicle battery packs and requires durable dispensing equipment to withstand demanding application challenges.
Related Materials
Single and plural component dispensable thermal interface materials (TIMs) are widely used in thermal management applications.
Laird T-Putty 508
Laird T-Putty 508 is a thermal paste designed for heat dissipation in electronics applications.
Laird T-Putty 607
Laird T-Putty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind.
Therm-a-Gap Gel 30
THERM-A-GAP Gel 30 is a dispensable, very low-compression force thermal gap filler that provides superior long-term thermal stability and reliable performance.
Therm-a-Gap TC50
THERM-A-GAP™ TC50 is a high-performance, single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity.
LORD CoolTherm SC-1200
LORD CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component material designed to provide excellent thermal conductivity for electronic and battery applications.
LORD CoolTherm TC-2002
CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
