Electronics Manufacturing Solutions

Thermal Management

Dispense Solutions for Thermal Management

As the world moves more towards electrification, the need to manufacture electronics is increasing. Consumer and industrial demand for greater functionality with a smaller product footprint make managing the thermal load critical to product life cycles and reliability.

Thermal interface materials help efficiently dissipate the heat generated in electronic parts. Accurate dispense of TIMs is important to the performance, quality and durability of electronic products.

Comparing 1k Metering & Dispensing Systems

Shot size, flow rate, material properties, and manufacturing style should be considered when to choosing a one component (1K) dispensing solution.

Comparing 2k Meter Mix Dispense Systems

Chart compares advanced two-component meter mix dispense (MMD) systems, including PR-X, PD44, PR70, EFR, and HFR.

Extreme Material Abrasiveness? Problem Solved with Elite

Some thermal interface materials (TIMs) are so abrasive, it’s like pumping diamond dust or liquid sandpaper. Explore why and how we developed Elite, the longest-lasting pump construction for abrasive material dispense.

Thermal Management for EV Battery and Electronics Manufacturing

Whether it’s assembling electric vehicle (EV) batteries and electronic products, or miniaturizing printed circuit boards (PCBs), thermal management remains crucial to longevity, efficiency and safety.

Thermal Paste vs. Thermal Pads

Understanding the differences between thermal pads and dispensable thermal interface materials (TIMs) for dissipating heat in electronics can improve manufacturing efficiencies.

Single and plural component dispensable thermal interface materials (TIMs) are widely used in thermal management applications.

Laird T-Putty 508

Laird T-Putty 508 is a thermal paste designed for heat dissipation in electronics applications.

Laird T-Putty 607

Laird T-Putty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind.

Therm-a-Gap Gel 30

THERM-A-GAP Gel 30 is a dispensable, very low-compression force thermal gap filler that provides superior long-term thermal stability and reliable performance.

Therm-a-Gap TC50

THERM-A-GAP™ TC50 is a high-performance, single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity.

LORD CoolTherm SC-1200

Parker Lord CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component material designed to provide excellent thermal conductivity for electronic and battery applications.

LORD CoolTherm TC-2002

Parker Lord CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.