Electronics Manufacturing Solutions
Dispense Solutions for Bonding
With the increasing demand for miniaturization and versatility in electronics, bonding is replacing conventional mechanical fastening methods that involve riveting, welding and screwing.
Bonding is used on anything from smaller components on circuit boards, to larger electronic housing or structural assemblies. Precision in application can assure proper adhesion.
Comparing 1k Metering & Dispensing Systems
Shot size, flow rate, material properties, and manufacturing style should be considered when to choosing a one component (1K) dispensing solution.
Comparing 2k Meter Mix Dispense Systems
Chart compares advanced two-component meter mix dispense (MMD) systems, including PR-X, PD44, PR70, EFR, and HFR.
Dispensing Silver Epoxy with Jet Valves
Using jet valves for dispensing conductive adhesives like silver epoxy requires application flexibility and unparalleled precision.
Jet Valve Dispensing - Easy to set up and Maintain
The simplicity of Graco’s patented diaphragm jet, with only two internal moving parts, delivers one of the industry’s lowest running costs per million cycles of the jet.
One Component Metering Systems Performance Evaluation for Sealing Applications
Compare three primary solutions for continuous single component dispensing applications: precision gear meter (PGM), precision continuous flow (PCF), E-Flo iQ.
Precision Dispense for Bonding and Sealing
When a product's functionality depends on a perfect bond or seal, dispensing an imperfect bead could lead to considerable cost implications.
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